Integrated Circuits and Systems
Code | School | Level | Credits | Semesters |
EEEE3098 | Electrical and Electronic Engineering | 3 | 20 | Autumn UK |
- Code
- EEEE3098
- School
- Electrical and Electronic Engineering
- Level
- 3
- Credits
- 20
- Semesters
- Autumn UK
Summary
The module introduces CMOS integrated circuit design and internal operating mechanisms of semiconductor electronics and opto-electronic devices.
Reassessment of this module, if required, will be 100% by a centrally timetabled exam in the University's resit period exam.
Target Students
3rd and 4th year MSc students in the Department of Electrical and Electronic Engineering
Assessment
- 30% Coursework 1: Solution to 10 short design problems, 10 pages
- 30% Coursework 2: VLSI Design and report of 12 pages
- 40% Exam (2-hour)
Assessed by end of autumn semester
Educational Aims
To introduce students to the main principles of integrated circuits (IC) design for digital electronic systems. This is based around CMOS technology that is used to fabricate the majority of ICs today. Internal operation of typical electronic and optoelectronic semiconductor devices is introduced.Learning Outcomes
By the end of the module, students should be able to:
LO1 Analyse the circuit schematics from the transistor level to chip level.
LO2 Design combinational circuit schematics at the transistor level.
LO3 Design sequential circuit schematics at the transistor level.
LO4 Design physical layout of transistor-level circuits.
LO5 Understand how semiconductor devices operate and be able to identify the limitations of simple (e.g. phenomenological) device models.
LO6 Correctly analyse and describe the behaviour of physical processes with mathematical equations.
LO7 Analyse and describe the properties of devices by combining structural and material information about the device with mathematical descriptions of the relevant physical processes.
LO8 Design a semiconductor device by relating its performance to the underlying physical processes and materials properties and properly applying the mathematical description of the device behaviour and its underlying physical processes.
This module contributes to the delivery of the following Engineering Council outcomes:
C1, M1, C2, M2, C3, M3, C4, M4, C5, M5, C6, M6, C12, M12, C13, M13, C17 and M17